Power Cycling with High Temperature Swing of Discrete Components based on Different Technologies
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Abstract
We present the results of power cycling tests of
transfer molded, DCB and copper based power components at
temperature swings up to 155K. The results of the DCB based
components are statistically analysed with Weibull
distribution. An Analysis of the components after the tests
provide an overview on the failure mechanisms. The results of
the DCB based, transfer molded components exceed the
expectations based on extrapolation of LESIT results.