Evaluation of a DCB based Transfer Molded Component with High Temperature Swings

dc.contributor.authorAmro, Raed
dc.date.accessioned2022-12-21T07:41:27Z
dc.date.available2022-12-21T07:41:27Z
dc.date.issued2004
dc.description.abstractIn this paper we present the results of power cycling tests of transfer molded, DCB based power components at temperature swings up to 155 K. The results are statistically analysed. The tested components show a power cycling capability approximately 10 times higher as expected from extrapolation of results of standard power modules.en_US
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/8791
dc.language.isoenen_US
dc.titleEvaluation of a DCB based Transfer Molded Component with High Temperature Swingsen_US
dc.typeOtheren_US

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