Power Cycling with High Temperature Swing of Discrete Components based on Different Technologies

Abstract

We present the results of power cycling tests of transfer molded, DCB and copper based power components at temperature swings up to 155K. The results of the DCB based components are statistically analysed with Weibull distribution. An Analysis of the components after the tests provide an overview on the failure mechanisms. The results of the DCB based, transfer molded components exceed the expectations based on extrapolation of LESIT results.