Evaluation of a DCB based Transfer Molded Component with High Temperature Swings

dc.contributor.author	Amro, Raed
dc.date.accessioned	2022-12-21T07:41:27Z
dc.date.available	2022-12-21T07:41:27Z
dc.date.issued	2004
dc.identifier.uri	http://localhost:8080/xmlui/handle/123456789/8791
dc.description.abstract	In this paper we present the results of power cycling tests of transfer molded, DCB based power components at temperature swings up to 155 K. The results are statistically analysed. The tested components show a power cycling capability approximately 10 times higher as expected from extrapolation of results of standard power modules.	en_US
dc.language.iso	en	en_US
dc.title	Evaluation of a DCB based Transfer Molded Component with High Temperature Swings	en_US
dc.type	Other	en_US